Pace Tf1800 Bga Ve Smd Tamir Sistemi

Pace Marka Tf1800 Bga And Smd Rework System adlı malzemeyi Pace Türkiye Distribütörü firmamızdan temin edebilirsiniz.

Konvansiyonel rezistanslı ısıtma teknolojisi, çeşitli BGA, QFN, CSP, CGA, PoP, Flip Chip, 0201 ve diğer alt sonlandırılmış bileşenleri takmak ve çıkarmak için konvektif yeniden işleme istasyonlarında yıllardır başarıyla kullanılmaktadır. Bununla birlikte, günümüzün son derece yüksek termal kütle panoları, ultra ince hatve bileşenleri ve zorlu üretim yeniden işleme ortamları, her zamankinden daha fazla proses kontrolü, termal performans ve daha hızlı üretim gerektirir.

PACE'in TF 1800 BGA / SMD'sini girin Rework Sistemi. Çığır açan, patentli Endüktif-Konveksiyonlu Isıtma Teknolojisi ile TF 1800'ün üst taraf ısıtıcısı, hemen hemen her bileşende güvenli, hızlı lehim eklemi yeniden akışı için birkaç saniye içinde hedef sıcaklığa ulaşır. yükleme veya kaldırma uygulaması.

 

Top-Side Heater: Fast Heat Up - Rapid Cool Down

PACE’s Inductive-Convection Heater easily outperforms competitive heaters which utilize standard forced air convection technology, achieving target temperature instantaneously, about 4x faster than competitive heaters. Unlike conventional heaters, the TF 1800 immediately drops to temperatures well below solder melt when the heater is de-energized (results shown for TF 1800 Heater). 
  

 

 

 

How Inductive-Convection Heating Works

The TF 1800’s patented Inductive-Convection Heating Technology provides ultimate thermal performance by its ability to instantly heat up and cool down the temperature of the air it delivers to the work.

1.) The air is first pre-heated in the outer heater chamber as it moves in a cyclonic fashion around the induction coil before it enters the inner chamber.  2.) After entering the inner chamber, the pre-heated air is then heated to target temperature through a highly efficient heat transfer process in an energized induction field. 3.) During active cooling, the induction coil is de-energized and the TF 1800 delivers fast, controlled, active cooling of the component and PCB directly through the nozzle, eliminating the risk of excessive intermetallic growth and yielding the highest quality solder joints.

Powerful, Energy Efficient Performance

The TF 1800’s Inductive-Convection Heating Technology delivers all the power you need to tackle the most challenging high thermal mass PCBs available today. Yet, its highly-efficient design does it with just a fraction of the power required by yesterday’s conventional heating technology.

Advanced Features

 

Ultra-High Precision Placement Capability

Newly designed motorized reflow head is driven by an advanced stepper motor system which provides smooth, high precision, repeatable movement with no drift, allowing for soft landing of components and 28µm (.0011") placement accuracy.

 

 

High Sensitivity Vacuum Pick Assembly

New Vacuum Pick design is more robust, utilizes an optical sensor, is counterweight balanced, and uses precision high temperature linear ball bearings for the highest sensitivity in placement and pick-up. Includes 7 Vacuum Picks.

 

 

PACE Exclusive Height Adjustable Bottom-Side Preheater

High powered medium/long wave quartz IR heating elements respond faster with 1000W of power. The preheater height is adjustable from standard position up to 38mm (1.5") closer to the PCB for the most challenging high thermal mass boards.

 

 

Integrated Board Support Wand

An innovative Board Support Wand prevents warping or sagging during reflow, is extremely adjustable to clear parts on the bottom of PCB, and is easily removed when not in use.

 

 

High-Definition Optical Alignment System

An automated Vision Overlay System uses a beam-splitting prism for simultaneous view of PCB pads and balls, high intensity LEDs for shadow-free lighting, and new high definition 1080p camera to easily align any component.

 

 

Crisp Clear Images for Component Alignment

A high definition Vision Overlay System uses bright white LEDs with independent intensity control and up to 240x zoom capability to provide precise distinction of pads and solder ball or leads.

 

 

Quad-Field Imaging for Large/Fine Pitch BGA's

Quad-Field Imaging allows up to four corners of a large component (and its pads) to be viewed under high magnification, providing perfect alignment of outsized BGAs or fine-pitch QFPs.

 

 

Fourth Generation Software Suite

Newly designed Windows-based software provides a simple graphical interface with intuitive set-up and profiling, on-the-fly profile adjustment, unlimited profile storage and much more.